An Introduction to Electronics System Packaging

An Introduction to Electronics System Packaging
An Introduction to Electronics Systems Packaging by Prof. G.V. Mahesh, Department of Electronic system Engineering, IISc Bangalore.For more details on NPTEL visit
Mod-01 Lec-01 Introduction and Objectives of the course
Mod-01 Lec-02 Definition of a system and history of semiconductors
Mod-01 Lec-03 Products and levels of packaging
Mod-01 Lec-04 Packaging aspects of handheld products; Case studies in applications
Mod-01 Lec-05 Case Study (continued); Definition of PWB, summary and Questions for review
Mod-02 Lec-06 Basics of Semiconductor and Process flowchart; Video on "Sand-to-Silicon"
Mod-02 Lec-07 Wafer fabrication, inspection and testing
Mod-02 Lec-08 Wafer packaging; Packaging evolution; Chip connection choices
Mod-02 Lec-09 Wire bonding, TAB and flipchip-1
Mod-02 Lec-10 Wire bonding, TAB and flipchip-2; Tutorials
Mod-03 Lec-11 Why packaging? & Single chip packages or modules (SCM)
Mod-03 Lec-12 Commonly used packages and advanced packages; Materials in packages
Mod-03 Lec-13 Advances packages (cont),Thermal mismatch in packages,Current trends in packaging
Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps
Mod-04 Lec-15 Electrical Issues -- I; Resistive Parasitic
Mod-04 Lec-16 Electrical Issues -- II; Capacitive and Inductive Parasitic
Mod-04 Lec-17 Electrical Issues -- III; Layout guidelines and the Reflection problem
Mod-04 Lec-18 Electrical Issues -- IV; Interconnection
Mod-05 Lec-19 Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT
Mod-05 Lec-20 Components of a CAD package and its highlights
Mod-05 Lec-21 Design Flow considerations; Beginning a circuit design with schematic work
Mod-05 Lec-22 Demo and examples of layout and routing; Technology file generation from CAD;
Mod-06 Lec-23 Review of CAD output files for PCB fabrication; Photo plotting and mask generation
Mod-06 Lec-24 Process flow-chart; Vias; PWB substrates
Mod-06 Lec-25 Substrates continued; Video highlights; Surface preparation
Mod-06 Lec-26 Photoresist and application methods,UV exposure and developing
Mod-06 Lec-27 PWB etching; Resist stripping; Screen-printing technology
Mod-06 Lec-28 Through-hole manufacture process steps; Panel and pattern plating methods
Mod-06 Lec-29 Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs
Mod-06 Lec-30 Microvia technology and Sequential build-up technology process flow for high-density
Mod-06 Lec-31 Conventional Vs HDI technologies; Flexible circuits; Tutorial session
Mod-07 Lec-32 SMD benefits; Design issues; Introduction to soldering
Mod-07 Lec-33 Reflow and Wave Soldering methods to attach SMDs
Mod-07 Lec-34 Solders; Wetting of solders; Flux and its properties; Defects in wave soldering
Mod-07 Lec-35 Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures
Mod-07 Lec-36 SMT failure library and Tin Whiskers
Mod-07 Lec-37 Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow soldering
Mod-07 Lec-38 Lead-free solder considerations,green electronics,RoHS compli & e-waste recycling iss
Mod-08 Lec-39 Thermal Design considerations in systems packaging
Mod-09 Lec-40 Introduction to embedded passives; Need for embedded passives; Design Library
Mod-09 Lec-41 Embedded capacitors; Processes for embedding capacitors; Case study examples